| 摘要 |
PURPOSE:To make it possible to enhance the temp. detection capacity of a sensor without limiting a material while making the sensor easy to process, by fixing the semiconductive temp.-sensitive element connected to the leading end of a lead wire to a support so as to expose the same to the surface of said support. CONSTITUTION:A support 3 is formed of a cylindrical body 3a and a through-hole 16 is provided to the bottom wall 15 of the cylindrical body 3a and a semiconductive temp.-sensitive element 2 is mounted so as to be protruded from the through-hole 16. A lead wire 1 is passed through the cylindrical body 3a to be led out from the opening at the upper end of the cylindrical body 3a and the bottom part of the cylindrical body 3a is filled with a water sealing material 17 such as a resin not only to prevent the penetration of water in the cylindrical body 3a from the through-hole 16 but also to fix the lead wire 1 or the temp.-sensitive element 2. Because the temp.- sensitive element 2 is held to a state exposed to the outside from the support 3, the heat of hot water in a hot water tank 10 is directly transmitted to the temp.-sensitive element 3 and the material quality of the cylindrical body 3a constituting the support 3 can be selected regardless of heat conductivity and, for example, a cylinder diameter can be largely formed by a resin molded product.
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