| 摘要 |
PURPOSE:To obtain the title resin composition having a high glass transition temperature and excellent heat resistance and flexibility, by mixing an epoxy resin with trimellitic anhydride triglyceride as a curing agent, a cure accelerator and a flexibilizer. CONSTITUTION:The purpose epoxy resin composition is obtained by mixing an epoxy resin (A) (e.g., phenol novolak epoxy resin) with a curing agent (B) comprising trimellitic anhydride triglyceridee of the formula, a cure accelerator (C) (e.g., triethylamine tetraphenylborate) and a flexibilizer (D) (e.g., carboxyl group-terminated polybutadiene or epoxy-modified silicone intermediate) as essential components. this epoxy resin composition has such heat resistance that it can be used at temperatures as high as about 200 deg., does not crack and can be suitably used as a material for electronic components, a material for laminates or the like.
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