| 摘要 |
The invention relates to polyepoxides which are obtainable by reacting compounds of formula I <IMAGE> (I) wherein n is 1 or 2, and X, if n is 1, is a group R3, or, if n is 2, X is a group of the formula <IMAGE> each of R1 and R3 independently of the other is C1-C4alkyl, C1-C4alkoxy, allyl, a halogen atom or C6-C10aryl and R2 is allyl, 1-propenyl or 2-propenyl, with compounds containing phenolic OH groups, and subsequently epoxidizing the resultant adducts in the presence of a peracid. Said polyepoxides can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for coating electronic components, or as adhesives.
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