| 摘要 |
An electrical interconnection assembly is disclosed for use with high voltage devices such as traveling-wave tubes. The assembly includes an electrically insulating housing having a plurality of recesses formed in its outer and inner surfaces. Leads from the high voltage device can be connected directly to respective conductive pins mounted in recesses in the housing inner surface, and electrical conductors from a power supply can be connected directly to respective conductive pins mounted in recesses in the outer surface of the housing and which are electrically connected to respective conductive pins on the inner surface. Protruding staggered gripping elements on the housing outer surface and on a removable cover plate for the housing minimize the possibility of separation of electrical conductors from the conductive pins.
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