发明名称 |
Method for selectively bonding substrate having fine electroconductive pattern |
摘要 |
A method for selectively bonding a substrate having an electroconductive pattern to another substrate at selected portions of the pattern. An adhesive layer is formed on the selected portion of the pattern by the electrodeposition of a high molecular resin and the substrate is then bonded to the other substrate by means of the adhesive layer.
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申请公布号 |
US4676854(A) |
申请公布日期 |
1987.06.30 |
申请号 |
US19850808141 |
申请日期 |
1985.12.12 |
申请人 |
SHINTO PAINT CO., LTD. |
发明人 |
SUZUKI, TAMEYUKI;KAMAKURA, TAKURO |
分类号 |
H01R4/04;H05K3/24;H05K3/32;H05K3/36;(IPC1-7):C25D15/00;B32B31/12 |
主分类号 |
H01R4/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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