| 摘要 |
PURPOSE:To extremely shorten a containing time of a wafer in a carrier box by forcibly cooling the heat treated wafer by a cooling stage even if the thermal capacity of an epitaxial furnace or a diffusing furnace for a heat treating process is large. CONSTITUTION:Wafers introduced into a heat treating process are removed by an operator after the heat treatment is finished, and placed on a cooling stage 2. In this case, the operator operates a keyboard 23 to instruct the wafer removing order to a CPU 20. When the CPU 20 is instructed by the removing order, the CPU 20 detects on which position of a carrier box 3 the wafer is placed on the stage 2 at present time from the removing order and an order data in an RAM 22. When detecting the containing position of the wafer, the CPU 20 suitably drives a wafer moving plate 15 and conveyor belts 16, 16 to contain the wafer on the stage 2 in the original position of the box 3. The operation of the plate 15 and the belts 16, 16 of this case are reverse to the wafer removing operation.
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