| 摘要 |
PURPOSE:To bond at fine scrubbing and at lower temperature (400 deg.C or lower) than conventional temperature by utilizing an ultrasonic wave at die bonding time. CONSTITUTION:When a voltage is applied by an oscillator, not shown, to Langevin type piezoelectric vibrator 11, a vibration is generated to propagate through a horn 12 to an attracting collet 1. Since an IC chip 3 placed through a brazing material on a ceramic case 4 is contacted closely with the collet 1, the ultrasonic vibration is transmitted to the chip to be die bonded. Thus, an ultrasonic die bonder head which can die bond at fine scrubbing and at lower temperature (400 deg.C or lower) than conventional temperature is obtained. |
