| 摘要 |
PURPOSE:To obtain a semiconductor device which is superior in mass production capability and has a small sealed shape by thermally pressing a base member which is to be mounted with a semiconductor element and a lid member which has a transparent region with a preimpregnation member previously attached to each member. CONSTITUTION:A lid 13 which has a glass 10 for light transmission and a base 12 are made by transfer formation and a B stage preimpregnation member is made by a vacuum press by heating glass cloth and resin powder. Then, a square preimpregnation member 14 by metal-punching the preimpregnation member and a preimpregnation member 15 wherein the squarely cut inside surface of the preimpregnation member is further squarely cut are formed and these are thermally welded over the base 12 and under the lid 13 respectively. Then, a chip 1 is die-bonded on the die pad 51 of a lead frame 5 and the chip 1 and a lead wire 52 are bonded with a gold wire 4. Then, the lead frame 5 is interposed between the base 12 and the lid 13, thermally pressed, a space 16 is formed and the open air is shut off. This construction reduces the external shape to approx. 1/3 of conventional one and improves mass production capability. |
