| 摘要 |
PURPOSE:To form an electric conductor at favorable adhesion and simultaneously on an arbitrary part necessitating conductorization treatment, by a method wherein electrically conductive coating is applied to the surface of a desired mold over which an electrically conductive shield film is formed and then the surface of a molded resin case member is covered with a conductive film based on coating by casting resin into the mold. CONSTITUTION:An electrically conductive layer having a thickness to the extent of 50-60mum is clad over a protrusion side core of a mold by spraying electrically-conductive coating to the core by a spray gun and a clad film is dried, to begin with, at the time of molding of an upper case (case member) of a telephone for a microcomputer. Then when, for example, plastic molding is performed by casting an ABS base material within the mold, an electrically conductive skin layer is obtained at a time. The electrically conductive layer adhering closely to a plastic molded member (case member) possesses high mechanical adhesion strength which satisfies adhesion test based on, for example, the Underwriter's safety standards, UL-746C 37A. |
