| 摘要 |
PURPOSE:To erase a ghost image appeared on an image output by controlling the form of an optical adhesive packing part when a solid-state image pickup device substrate is stuck on a transparent mounting substrate. CONSTITUTION:When a transparent insulation substrate 2 and a transparent mounting substrate 4 in the solid-state image pickup device are stuck, the form of the adhesive is controlled by bringing into contact a steel wire shaped body 5 with an optical adhesive packing part 3 while the adhesive is not solidified, and utilizing a viscosity and a surface tension in the sticking agent. After the adhesive is solidified thoroughly, the steel wire shaped body 5 is stripped off. In this way, reflected light from the packing part 3 can be evaded from the plane of a photodetecting element 1, then the ghost image being erased.
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