发明名称 MANUFACTURE OF LEAD FRAME
摘要 PURPOSE:To protect a bonding lead from buckling by a method wherein a portion with its width somewhat smaller than a prescribed lead width is provided at the end of a bonding lead and is pressed along the direction of the lead length for the realization of a flattened bonding surface. CONSTITUTION:At the ends of leads parallelly arranged in the direction of the thickness of a supporting metal plate 5, a pellet mounting section 1 and wire-bonding section 3 are formed under press. In this process, the end of a lead constituting a bonding section 3 is provided with a smaller-width section 2. The smaller-width section 2 is pressed along the direction of the lead length for the formation of a flattened end surface. As the result, difference in height is created along the direction of the lead width on the boundary of the smaller- width section 2 and bonding section 3. This protects the bonding section 3 from buckling.
申请公布号 JPS62143449(A) 申请公布日期 1987.06.26
申请号 JP19850283069 申请日期 1985.12.18
申请人 TOSHIBA CORP 发明人 KOBAYASHI SATORU
分类号 H01L23/48;H01L21/48 主分类号 H01L23/48
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