| 摘要 |
PURPOSE:To arrange a wafer at a prescribed position by a method wherein the wafer is rolled and slid along the prescribed guide surface with just inclining the mounting base mounted with the wafer and the positioning is performed at the position of the prescribed stopper. CONSTITUTION:A wafer 1 is placed on a mounting surface 2a at the end part on one side of a mounting base 2. The base 2 is inclined using a first lever 7 in such a way that a guide 3 is turned to the lower side. The base 2 is inclined using a second layer 8 in such a way that a stopper 5 is turned to the lower side. A compressed air is fed in an air chamber 9 and is made to blow off through air nozzles 6. The wafer 1 is rolled on a guide surface 4 of the guide 3. When an orientation flat 1a of the wafer 1 comes into contact on the guide surface 4, the rolling of the wafer 1 is stopped and the wafer 1 is slid on the guide surface 4. When the wafer 1 is abutted on the stopper 5, the sliding operation is stopped. Thereby, the wafer 1 is arranged at a prescribed position.
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