| 摘要 |
PURPOSE:To simplify a manufacturing process and to decrease a cost by forming a layer in which many conductive particles in the mutually electric insulating condition are packed, at the surface of the supporting body and constituting a developer carrier. CONSTITUTION:After a sheet-shaped rubber dielectric layer 10 is bonded at the outer circumference of the supporting body 8 by adhesives 9, heating and curing are executed, after the material containing a conductive particle composed of an aluminum particle, etc., into the liquid-shaped or semifluid-shaped coating material is sprayed and coated on the layer, heating and drying are executed, and a conductive particle filling layer 11 is formed. The surface is ground and made into a developer holding body 5, and when this is pushed to the potosensitive body and developed, the suitable nip width can be obtained by the elastic deformation of a surface. Consequently, since it is not necessary to insulate and coat the conductive particles beforehand, the manufacturing process is made easy and the cost can be decreased. |
