| 摘要 |
<p>PURPOSE:To improve the cooling efficiency of elements and to enable a device to have reduced dimensions, by applying a heat-transfer plate to the side of a single flat semiconductor element or a stack of a plurality of such elements opposite to a cooling body, while applying the heat-transfer plate to a heat-transfer rod having an end contacted with the cooling body. CONSTITUTION:A flat semiconductor element 1a is applied to a cooling body 2 through an insulation sheet 5. A heat-transfer plate 6a is applied to the side of the semiconductor element 1a opposite to the cooling body 2 through another insulation sheet 5. A flat semiconductor element 1b is applied to the heat-transfer plate 6a through an insulation sheet 5 so that the elements 1a and 1b are stacked. A heat-transfer plate 6b is applied to the end face of the element 1b opposite to the cooling body 2 through an insulation sheet 5, and the heat- transfer plate 6b is pressed against the cooling body 2 by threading a clamping fitment into the cooling body 2. The heat-transfer plates 6a and 6b are arranged vertically on the cooling body 2 while the ends thereof are joined to a heat-transfer rod 7 buried in the cooling body 2. Connecting conductor bars 4 for example are led out from the ends of the elements 1a and 1b, and the elements 1a and 1b are connected to each other in series or in parallel by the conductor bars 4. Accordingly, heat can be transferred well from the faces of the flat semiconductor elements to the cooling body and therefore the elements can be cooled effectively.</p> |
