| 摘要 |
PURPOSE:To eliminate cracks, strain and the like, by attaching the element of a semiconductor device to a supporting body through a reinforcing plate, which is slightly larger than a substrate. CONSTITUTION:In assembling processes of a semiconductor, a semiconductor element 1 is bonded to a substrate supporting body 2. The element is connected to a frame 3 with conductor wire 4. The device is molded with a resin 5. At this time, mechanical strain is yielded in the semiconductor element 1 due to high temperature and pressure. Thereafter, the device is contracted by the curing of the resin. The semiconductor element as well as the substrate supporting body 2 receive high pressure and stress. Sometimes, damages such as cracks are yielded in the semiconductor element. The substrate supporting body 2 is a thin plate, which is made of a raw material having sufficient hardness for alleviating the stress and therefore strong. A reinforcing plate 6 has sufficient hardness, and the thickness of the plate can be designed so as to make it thicker than the substrate supporting body 2 and the frame 3. The plate 6 serves the role of alleviating a force, which is applied on the semiconductor element 1 with respect to stress received from a surrounding part. Thus, cracks, strain and the like in the element 1 can be prevented. |
