| 摘要 |
PURPOSE:To facilitate the formation of a package and thereby to improve the reliability by a method wherein a semiconductor chip wire-bonded to connect with lead pins is mounted on a glass-epoxy plate wherein said lead pins are planted, and the whole is buried in plastic mold except for the projecting portion of each of the aforesaid lead pins. CONSTITUTION:A semiconductor chip 3 is mounted on a glass-epoxy plate 2 in which lead pins 1 are planted, and after the completion of wire bonding, lead pin terminals are coated by dipping. A pin cover 10 is made of a material such as metal, ceramic or epoxy and has holes 11 formed so that they are fitted on the respective pin terminals of the lead pins. Then, a plastic mold material put in a liquid state by heating is injected under high pressure. After the mold material is set, a package is taken out of molding dies. |
