发明名称 RESIN SEAL MOLD
摘要 PURPOSE:To reduce the roll-in of air in a runner during the transfer of a resin, and to ensure the smooth state of transfer by forming a wall surface in contact with the resin in the runner into a roughened surface shape. CONSTITUTION:A pot 21 housing and melting a resin is bored at approximately the center of a joint surface with a top force in a runner block 20, and a plurality of main runners 22 with approximately recessed sections are formed radially centering around the pot 21. Wall surfaces in contact with a molten resin in the main runners 22 are formed into a roughened shape, such as a satin shape. Surface roughness is formed at a value such as approximately 8-S-12-S through electric discharge machining or shot peening work or the like. Accordingly, the mixing of air during the transfer of the molten resin is reduced while the temperature distribution of the resin is also equalized, thus allowing excellent resin seal molding having few dispersion.
申请公布号 JPS62140426(A) 申请公布日期 1987.06.24
申请号 JP19850282339 申请日期 1985.12.16
申请人 OKI ELECTRIC IND CO LTD 发明人 OKUAKI YUTAKA;NANBU MASATAKE
分类号 H01L21/56;B29C33/42;B29C45/02;B29C45/14;B29C45/26;B29C45/27;B29L31/34 主分类号 H01L21/56
代理机构 代理人
主权项
地址