发明名称 PREPARATION OF BASE PLATE FOR FORMING ELECTRIC CIRCUIT
摘要 <p>PURPOSE:To make mass production possible by preparing a five-layer structure consisting of releasing film/adhesive/heat-resistant insulating material/adhesive/releasing film of continuous length and by adhering a metal foil of continuous length and a metal base plate of continuous length on one surface and the other surface respectively after releasing films of both surfaces are removed. CONSTITUTION:(a) After an adhesive is applied on both sides of a heat-resistant insulating material 1, releasing films are laminated, pressed and adhered on both surfaces to prepare a five-layer structure consisting of releasing film/adhesive/heat-resistance insulating material/adhesive/releasing film, which is thereafter wound into a coil C3. In this case, the releasing films are used when the adhesive layer should be protected in the operational process. (b) The releasing films are thereafter removed from both surfaces of this five-layer structure wound into the coil C3 and are wound into a coil C4. The exposed adhesive on one surface and a copper foil 5 pulled out from a coil C5 as well as the exposed adhesive on the other surface out from a coil C5 as well as the exposed adhesive on the other surface and an iron base plate 8 of continuous length are pressed and adhered by means of rolls R to prepare a base plate for forming electric circuit of five-layer structure consisting of copper foil/ adhesive/heat-resistant insulating material/adhesive/iron base plate, which is wound into a coil C7.</p>
申请公布号 JPS62140826(A) 申请公布日期 1987.06.24
申请号 JP19850280484 申请日期 1985.12.13
申请人 KOBE STEEL LTD 发明人 KAWAI HIROSHI;MANABE SHINICHI
分类号 B32B38/00;B29C65/52;B29L9/00;B32B15/08;B32B43/00;H05K3/38 主分类号 B32B38/00
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