发明名称 PREPARATION OF BASE PLATE FOR FORMING ELECTRIC CIRCUIT
摘要 PURPOSE:To make production possible without air evacuation by preparing a five-layer structure consisting of metal foil/adhesive/heat-resistant insulating material/adhesive/releasing film of continuous length and adhere a metal base plate of continuous length after removing the releasing film. CONSTITUTION:(a) After an adhesive is applied on both sides of a heat-resistant insulating material 1, a releasing film 2 and a copper foil 3 are laminated, pressed and thereby adhered on one side and the other side respectively to prepare a five-layer structure consisting of copper foil/adhesive/heat-resistant insulating material/adhesive/releasing film, which is wound into a coil C4. In the case, the releasing film is used when the adhesive layer should be protected in the operational process. (b) The releasing film is removed from the five-layer structure of copper foil/adhesive/heat-resistant insulating material/adhesive/ releasing film wound into the coil C and is wound into a coil C5, while the adhesive layer thereby exposed and an iron base plate 8 of sheet-shape or continuous length are pressed and adhered by means of rolls R1 to prepare a five-layer structure of metal foil/adhesive/heat-resistant insulating material/adhesive/iron base plate as a base plate for preparing electric circuit, which is wound into a coil C6.
申请公布号 JPS62140825(A) 申请公布日期 1987.06.24
申请号 JP19850280483 申请日期 1985.12.13
申请人 KOBE STEEL LTD 发明人 KAWAI HIROSHI;MANABE SHINICHI
分类号 B32B15/08;B29C65/48;B29L9/00;H05K3/38 主分类号 B32B15/08
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