| 摘要 |
PURPOSE:To prevent the lowering of yield, and to reduce the area of installation by horizontally mounting a nozzle and installing a base body at the forward position of the nozzle in a posture in which a semiconductor substrate in the base body faces vertically the nozzle. CONSTITUTION:A spin treater has a base body 3 sucking a semiconductor substrate 1 under a vacuum and turned by a spin motor 2 and a nozzle 6 atomizing a developer fed through a piping 4 and a gas introduced through a piping 5 against the surface of the semiconductor substrate 1. The nozzle 6 is fitted horizontally, and the base body 3 is installed into a cover 8 mounted at the forward position of the nozzle 6 at an attitude in which a substrate 3 as the base body 3 faces vertically the nozzle 6. The semiconductor substrate 1 transported to a predetermined position (a broken line section) by a carrier arm 7 is sucked by the horizontal displacement of the base body 3, and moved to the position of treatment. Accordingly, the semiconductor substrate is not contaminated by falling dust generated in environment, thus preventing the lowering of yield. |
