发明名称 LOW-TEMPERATURE SOLDERING POLYURETHANE INSULATED WIRE
摘要 PURPOSE:To obtain a polyurethane insulated wire which has a reduced soldering temperature without decreasing the heat resistance and softening temperature, by applying a one-pack thermosetting polyurethane coating containing a specified catalyst on a conductor and baking it. CONSTITUTION:A 1,8-diaza-bicyclo(5.4.0)undecene-7-organic acid salt and an alkyltin maleate of formula IX, as catalyst, are added each in an amount of 0.1-5%, based on the solids of a coating, to a one-pack thermosetting polyurethane coating obtained by dissolving in an organic solvent three components comprising a blocked polyisocyanate compound of formula I, a polyester oligomer synthesized by the condensation through dehydration of glycerin or ethylene glycol with terephthalic acid or dimethyl terephthalate, and an alcohol-soluble copolyamide resin. This mixture is applied on a conductor to give an insulated wire. In the formulas, n is 2-3; R is a group of formulas II-V; R' is a group of formulas VI-VIII; m is 1-3.
申请公布号 JPS62141076(A) 申请公布日期 1987.06.24
申请号 JP19850281657 申请日期 1985.12.16
申请人 TOTOKU ELECTRIC CO LTD 发明人 TSURUTA TOYOTOSHI;NISHIZAWA TOSHIRO;TSUCHIYA KIYOMI;YAMAZAKI YUZO;YOSHIKAWA HITOSHI
分类号 H01B3/30;C08G18/18;C08G18/20;C09D5/25;C09D175/00;C09D175/06 主分类号 H01B3/30
代理机构 代理人
主权项
地址
您可能感兴趣的专利