Photoresist compositions of controlled dissolution rate in alkaline developers.

摘要

A photoresist composition is disclosed which is a mixture of a photoactive compound and an alkali soluble resin binder comprised of an unsaturated dicarbosylic acid esterified polymeric material, such as a phenolic resin containing a plurality of acid esterifiable groups esterified with an unsaturated dicarboxylic acid anhydride having the formula
<Chemistry id="chema01" num="0001"><Image id="ia01" he="33" wi="60" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>wherein R, and R, are independently selected from hydrogen and alkyl groups containing 1 to 3 carbon atoms, R<Sub>3</Sub> and R<Sub>4</Sub> are alkylene groups containing 1 to 3 carbon atoms and x and y are either 0 to 1.