发明名称 RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To inhibit moisture intruding from the interfaces of leads, and to improve damp-proofing by forming tab leads in the zigzag direction and forming recessed sections on the surfaces and backs of the inner lead and the tab lead. CONSTITUTION:First recessed sections 21 and second recessed sections 22 are each shaped on the surfaces and backs of tap leads 4, 4 and inner leads 5..., and the tab leads 4, 4 are formed in meandering structure. Consequently, since there are the first and second recessed sections 21, 22 in paths through which moisture intrudes through the interfaces of the inner leads 5... and the tab leads 4, stress working to the interfaces of a lead frame and a resin layer 7 is complicated, thus improving adhesion, then resulting in the difficult movement of water. Fourth recessed sections 24 shaped to the peripheral section of the surface of a bed section 3 also function similarly, thus preventing easy intrusion to the surface of a pellet of moisture reaching a bed frame. Since the tab leads 4, 4 are shaped in the zigzag direction, effective distances up to the bed section 3 are lengthened, thus prolonging the time required for the intrusion of moisture.
申请公布号 JPS62140446(A) 申请公布日期 1987.06.24
申请号 JP19850282406 申请日期 1985.12.16
申请人 TOSHIBA CORP 发明人 ASADA MINETO;UMEKI MAKOTO;BABA ISAO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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