| 摘要 |
PURPOSE:To lighten the titled wiring circuit body, and to decrease the man-day of processing for heat dissipation by forming a base body by a molded shape from a synthetic resin and insert-molding and fixing a good heat conductor. CONSTITUTION:A base body 1 is shaped by a molded shape from a synthetic resin while a good heat conductor 2, at least one part thereof is exposed from the base body 1, is insert-molded and fastened to one part in the base body 1. Consequently, the heat generation of electric parts, electronic parts, a semiconductor chip 4, etc. loaded on the base body 1 can be dissipated from the good heat conductor 2. The base body 1 is formed, mainly comprising the synthetic resin, and the good heat conductor 2 is fitted only at a position where heat dissipation is needed, thus preventing weighting. The electrical insulating properties of a circuit shaped can be ensured, and the good heat conductor is further mounted through insert molding when the base body is molded by the synthetic resin. |
