| 摘要 |
PURPOSE:To form bending structure extremely easily by forming a recessed section on one hybrid integrated circuit substrate by a press and making a projecting section sink into the opposite main surface of the other hybrid integrated circuit substrate. CONSTITUTION:A circuit element 5 is fixed, an insulating film 3 for the separating sections of hybrid integrated circuit substrates 1, 2 is bent, and the opposite main surfaces of the hybrid integrated circuit substrates 1, 2 are brought into contact and a recessed section 7 is shaped into the hybrid integrated circuit substrate 1. The recessed section 7 is formed at least one position of the hybrid integrated circuit substrate 1 by a press in consideration of the degree of integration, and shaped at approximately the center of the periphery of the side in the longitudinal direction of the hybrid integrated circuit substrate 1. The recessed section 7 is formed on the main surface of the hybrid integrated circuit substrate 1 while a projecting section 8 is shaped on the opposite main surface side of the recessed section 7. The projecting section 8 is formed while the projecting section 8 sinks into the opposite main surface of the hybrid integrated circuit substrate 2, thus joining and unifying the hybrid integrated circuit substrates 1, 2. |
