发明名称 PARTIAL PLATING DEVICE
摘要 PURPOSE:To subject plating parts in proximity to a net body moving in proximity to a support having an aperture for bleeding a plating liquid at a V-shaped peak part to electroplating with high accuracy and good efficiency by supplying the plating liquid to the surface of the above-mentioned support via the net body. CONSTITUTION:The plating liquid 21 is pumped 32 to contact an anode 14 and is leached from an aperture 22 at the top end 20 of the support 13 of the plating liquid supplying body 11 through a passage 23 therein in the partial plating device 10. The plating liquid 21 wets the net body 15 covering the aperture 22 thereof and contacts a pair of the opposed plating parts 4 at forked top ends 2 acted as a cathode, thereby electroplating said parts. The net body 15 is tensed by a winding means 16 consisting of guide rollers 28, press rollers 29 and driving rollers 31 to cover the top end 20 at the peak of the support 13 and near the same and moves in an arrow A direction intersecting with the pass line, thus forming a transfer part for the plating liquid 21.
申请公布号 JPS62139895(A) 申请公布日期 1987.06.23
申请号 JP19850281217 申请日期 1985.12.16
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 MURATA YASUTO;TEZUKA JUNICHI;YAMAMOTO KENJI
分类号 C25D5/02;C25D5/06 主分类号 C25D5/02
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