发明名称 TREATING DEVICE FOR SUBSTRATE AND WAFER SURFACE
摘要 PURPOSE:To automatically convey a wafer without generating dust and to enhance the reliability of treatment by a method wherein the wafer is conveyed in the freely openable and sealable treating chamber by a pair of the arm and the fork on one side and the treatment finished wafer is returned to the wafer cassette by a pair of the arm and the fork on the other side. CONSTITUTION:An arm 12 is made to move, a wafer P at the uppermost position of a wafer cassette 9 on a freely ascendable and descendable wafer cassette stand 1 is taken out and the wafer P is placed on a wafer placing part 39 of a fork 37 by the rotation of the arm 12. Then, the fork 37 is made to move and the wafer P is placed on a stage 56 in a treating chamber 54 via a freely openable and closable gate and the fork 37 is returned to its former position. Then, the stage 56 is made to descend, the surface treatment of the wafer P is performed with process gas and after the treatment is completed, a treatment finished wafer P' is returned on a cassette 9' by the similar fork 37' and arm 12'. By these automatic conveyances, no dust is generated as with the case a belt conveyor is used, thereby enhancing the reliability of treatment.
申请公布号 JPS62139341(A) 申请公布日期 1987.06.23
申请号 JP19850280738 申请日期 1985.12.13
申请人 PLASMA SYST:KK 发明人 YAMAMOTO YUKIO
分类号 H01L21/677;B65G1/00;B65G1/07;H01L21/67;H01L21/68 主分类号 H01L21/677
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