| 摘要 |
PURPOSE:To increase the rigidity of an optical fiber part and to facilitate aligning operation by providing a metallic plating layer to the periphery of the optical fiber to specific thickness. CONSTITUTION:The metallic plating layer 7 grown on the periphery of the optical fiber 3 by an electrolytic plating method is provided while limited to only the periphery of the part where the optical fiber contacts solder. The optical fiber 3 is made normally of quartz glass and nonconductive, so it is difficult to stick the metallic plating layer by a general electrolytic plating method, but this problem is solved by forming a substrate by electroless plating. A substrate treatment is carried out by electroless plating, etc., on the surface of the optical fiber 3 and then a film of copper or nickel is formed to hundreds of micrometers - several millimeters by electrolytic plating by the same technique with an electroforming method to increase the rigidity of the optical fiber part.
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