| 摘要 |
PURPOSE:To make it possible to implement high density mounting of an IC without mounting a capacitor on a printed wiring board, by providing pads for attaching the capacitor to a ceramic case of the IC. CONSTITUTION:On a case 1, a grounding pad 6 is arranged at the extended part of an evaporated lead 4, which is extended from a pad 3 for attaching a grounding lead terminal. A power source pad 8 is arranged at the extended part of an evaporated lead 9, which is extended from a pad for attaching a power source lead terminal. The pads 6 and 8 are made to face each other. Figure 2 is a bird-eye view showing an example of mounting a capacitor by using an IC ceramic case 10. In the case 10, a grounding pad 14 and a power source pad 15 for mounting the capacitor 12 are arranged beforehand. The capacitor 12 is mounted by soldering as shown by a numeral 13 by using the grounding pad 14 and the power source pad 15. |
