| 摘要 |
PURPOSE:To make bonding time constant even if the number of pads is increased and to facilitate replacement of a defective semiconductor element, by holding a semiconductor element, a flexible substrate and a compressing plate with holding members as a unitary body, thereby pushing up the connecting pad parts of the flexible substrate with the pressing projections of the compressing plate, and compressing the pad parts to the pad parts of the semiconductor element. CONSTITUTION:A compressing plate 5, a flexible substrate 1 and a semiconductor element 4 are held and fixed with a pair of spring bodies (holding members) 7, which are provided through holes 6 and 6 that are provided at two places of the flexible substrate 1. On the upper surface of the compressing plate 5, pressing projections 8 are provided at places corresponding to connecting pads 2 and pad parts 3 of the semiconductor element 4. By the elastic holding force of the spring bodies 7, said pressing projections 8 push up the corresponding parts of the flexible substrate 1. The connecting pads 2 formed on the flexible substrate 1 are pushed up. The connecting pads 2 and the pad parts 3 of the semiconductor element 4 are compressed and fixed. It is suitable that the sizes of the compressing projection 8 are as follows: the diameter is 50-150mum and the height is about 50-200mum.
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