| 摘要 |
PURPOSE:To prevent attachment of unnecessary conductor metal to the edge of a conductor pattern, by quickly performing osmosis of peeling liquid into a resist film, and shortening a peeling time, when the resist film is removed after the conductor metal is evaporated in a lift-off method. CONSTITUTION:At first, a first resist film 14 is formed on a piezoelectric substrate 14. By using a mask 15, which is obtained by reversing a pattern having about the equal width as that a desired conductor pattern, exposure is performed to ultraviolet rays. A fusible part corresponding to the conductor pattern is dissolved and fused with developing liquid. Then an Al evaporated film 16 is formed on the surface of a substrate 13. A second resist film 17 is formed on the film 16. Thereafter, by using a second mask 18, which has the pattern equal to the desired conductor pattern, exposure is performed to the ultraviolet rays. A fusible part corresponding to the conductor pattern and the reversed pattern are formed. Thereafter the fusible part of the film 17 is dissolved and removed. The device is immersed in etching liquid. The film 16 formed on the side surface of the film 14 is removed. Thereafter, the remaining films 14 and 17 are dissolved and removed by a peeling liquid together with the film 16 remaining on the film 14.
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