| 摘要 |
PURPOSE:To improve the stability of a bath and film formation by incorporating Co and Ni ions, reducing agent, pH adjusting agent and buffer as well as tartarate ions and/or propionate ions, etc., as a complexing agent into the bath. CONSTITUTION:This electroless plating bath contains the Co ions, the reducing agent for the metallic ions, the pH adjusting agent, the complexing agent and the pH buffer. The bath contains the above-mentioned Co ions at 0.02-0.1mol/l concn. and contains Ni ions in addition to the Co ions. The bath contains the tartarate ions and/or propionate ions as the complexing agent and has 0.03-0.3mol/l total concn. thereof. The bath further contains malate ions and/or malonate ions as an acetylating agent. The bath contains 5-60g/l boric acid as the above-mentioned pH buffer. |
