发明名称 NEGATIVE RESIST
摘要 PURPOSE:To obtain the titled resist having an improved resolution and heat- resisting property by composing a novolak resin of a polycondensation product of paratertiary butylphenol and formaldehyde or paraphenylphenol and formaldehyde. CONSTITUTION:The titled resist comprises a diazonaphthoguinone sulfonic acid ester compd. of the novolak resin as the main component. Said novolak resin comprises the polycondensation product of paratertiary butylphenol and formaldehyde or paraphenylphenol and formaldehyde. The titled resist is formed by coating an org. solvent solution of the photoresist on the substrate to form the resist film. The negative pattern is formed by developing said resist coated film with radiating an ionizing radiation followed by dissolving selectively the obtd. resist pattern with an org. solvent to separate the radiated part and the non-radiated part. As the obtd. negative resist does not swell, and has the high resolution and heat-resisting property, the obtd. pattern does not deform while backing.
申请公布号 JPS62136636(A) 申请公布日期 1987.06.19
申请号 JP19850278368 申请日期 1985.12.10
申请人 NEC CORP 发明人 TANIGAKI KATSUMI
分类号 C08G8/28;G03F7/022;G03F7/023;G03F7/038;H01L21/027 主分类号 C08G8/28
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