| 摘要 |
PURPOSE:To improve a superposing accuracy in an aligning method by rotating a wafer at an angle corresponding to an inclination of the wafer to correct the position when the inclination of the wafer is larger than a predetermined value, and then reexecuting from a measurement of a displacement of other shot region. CONSTITUTION:An inclination of a wafer WF is obtained on the basis of a displacement stored in a memory. When the absolute value of an inclination thetais judged to be larger than a preset value, the number of remeasurements per one wafer is judged. When the number of the remeasurements is judged less than a predetermined number, a theta stage WS is rotated at -theta. After the stage WS is rotated, the measurement of the displacement of a designated shot is again performed. When the absolute value of the obtained inclination thetais judged to be the preset value or lower, the moving control correction value of an XY stage XYS is calculated. That is, the obtained inclination theta of the wafer and the elongation rate of the wafer are used as the movement control correction value of the XY stage XYS. Thus, higher superposing accuracy can be obtained. |
