| 摘要 |
PURPOSE:To obtain a probing device, which can position a needle for a probing card and a bonding pad easily without requiring especial skill and is also proper to automation, by forming an alignment mark to a chip to the probing card. CONSTITUTION:A probing card 10 is manufactured normally by a printed substrate by a glass epoxy resin, and probing needles 18 are fitted so as to correspond to bonding pads 16 formed onto chips 14. The probing needles 18 are brought into contact with the bonding pads 16, thus inspecting electric characteristics required. The proper positions of the probing card 10 are shaped by a transparent substance, such as glass, an acrylic resin, etc., and crossed positioning marks 20 are formed at the centers of the positions. An operator observes microscopes 24, and relatively moves a semiconductor wafer 12 to the probing card 10 so that the positioning marks 20 are each positioned on the intersections of dicing lines 22.
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