发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To facilitate connecting external connection leads to the mounting surface of a printed circuit board or the like without providing insertion holes or jigs on the mounting surface and improve a mounting integration density by a method wherein tip parts of the respective adjoining leads for external connection are bent in such a manner that the directions of the bent parts are opposite to each other and the bent arts exist on an identical plane. CONSTITUTION:The tip pars 2a of external connection leads 2 are bent in such a manner that the lower surfaces of the tip parts of the mutually adjoining leads 2 exist on an identical plane and the directions of the bending of the mutually adjoining leads 2 are opposite to each other. With this constitution, a zigzag line package 1 can be mounted on a printed circuit board or the like without providing mounting holes or sockets so that the volume required for mounting can be reduced, workability can be improved and lead processing cost can also be reduced.
申请公布号 JPS62136060(A) 申请公布日期 1987.06.19
申请号 JP19850277302 申请日期 1985.12.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIRAI TATSUYA
分类号 H01L23/50;H01L23/495;H05K3/34 主分类号 H01L23/50
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