发明名称 ADHESION PROCESSING
摘要 PURPOSE:To enable the adhesion processing providing practically sufficient adhesion strength and durability to be achieved by a method in which the resin film of vinyl chloride family and the resin film of polyolefin base are mutually stuck, while causing the copolymer film of ethylene-vinyl acetate having vinyl acetate amount of 24wt% or more and 30wt% or less to intervene between said two film, using high frequency wave, ultrasonic wave or impulse. CONSTITUTION:The internal heating by high frequency wave, ultrasonic wave, etc. or the external heating by low frequency wave are used for adhesion processing, and especially the method by the internal heating is preferable. When the resin film of vinyl chloride base in caused to adhere to the resin film of polyolefin base, the film of ethylene-vinyl acetate copolymer having vinyl acetate amount of 24wt% or more and 30wt% or less, is caused to intervene between said both resin films. Then the adhesion processing is carried out, using said adhesion processing device. Even if which adhesion processing is used, practically sufficient adhesion strength is obtained, and the durability of the stuck part also has sufficient efficiency. Further, its adhesion condition is remarkably excellent.
申请公布号 JPS62135345(A) 申请公布日期 1987.06.18
申请号 JP19850276643 申请日期 1985.12.09
申请人 MITSUBISHI KASEI VINYL CO 发明人 KINOSHITA KAZUYA;YAMANAKA MASAHIRO;TAKAGI ISAMU;YAMAGISHI HIROSHI;HIGUCHI MASAO
分类号 B29C65/04;B29C65/00;B29C65/08;B29C65/38;B29K23/00;B29K27/06;B29L9/00 主分类号 B29C65/04
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