| 摘要 |
<p>PURPOSE:To simplify mounting process of an integrated circuit by forming a lead terminal of a shape memory alloy having a memory shape that a portion projected from the lower surface of a substrate is bent and a property that returns to the memory shape by applying heat from a linear shape at ambient temperature. CONSTITUTION:A lead terminal 2 of an integrated circuit 1 which contains an integrated circuit chip in a DIP type package having the terminal 2 formed of a shape memory alloy and showing a linear shape at ambient temperature is inserted into a lead terminal inserting hole 4 formed at an integrated circuit mount of a mounting substrate 3. Then, when the terminal 2 is heated to a high temperature of its operating point or higher, the end projected from the lower surface of the substrate 3 of the terminal 2 is bent inside in the shape stored at high temperature. The thus bent portion in this state is secured by soldering with solder 5.</p> |
