| 摘要 |
PURPOSE:To improve lead supporting strength of a semiconductor device and to reduce the size of a package by placing a semiconductor chip through an insulating film on leads, sealing it with a resin, increasing the entire length of the leads and the burying length of the leads to the resin to prevent water from immersing. CONSTITUTION:Two central leads 12b, 12c are extended toward a semiconductor chip 11 side, bent substantially in L-shape at lower portions, the chip 11 is placed at a position designated by a broken line on the leads 12b, 12c, an oxide layer 16 is formed on the surface of the chip 11 at the leads 12 side to be insulated from the leads 12. Since the entire lengths of the leads 12b, 12c are increased and the burying length to resin 14 is increased, they prevent water and the like from immersing from the leads 12b, 12c through bonding wirings 13 to the chip 11 and increases the supporting strengths of the leads 12b, 12c. Accordingly, the supporting strengths of the leads 12b, 12c are maintained, water and the like is prevented from immersing to reduce a distance between insulators of the chip 11 and the package 15 and to reduce the size of the package 15. |
