| 摘要 |
PURPOSE:To maintain connection of bonding wiring with a wiring layer even if a bonding pad is corroded by connecting the layer with the pad directly under connecting portions of the wirings with the pad. CONSTITUTION:Internal wirings 21 of polysilicon extended on a silicon oxide film 2 arrive at a portion directly under a connecting portion of bonding wirings 9 with a bonding pad 6, and are connected with the pad 6 through a contacting hole 22 opened in an insulating film 4. Accordingly, the wirings 9 are electrically connected with the wirings 21 without intermediary of corrosion possible regions A, B. Even if the regions A, B are corroded in future, the wirings 21 can receive an electric signal from the wirings 9 through the pad 6. |
