| 摘要 |
<p>Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).</p> |
