发明名称 POURING SYSTEM FOR THERMOSETTING RESIN
摘要 PURPOSE:To contrive the remarkable reduction in working manhours as well as the shortening of a molding cycle by a method wherein the pouring of resin and the cleaning of a pouring head are effected automatically by the control of a control means. CONSTITUTION:When a pouring starting switch is operated, a control circuit 10 switches a changeover valve 42 and communicates a pouring head 12 with the pouring port of resin to start to supply the resin into a resin supplying device 14. The resin and curing agent, which are delivered from respective supplying sections 24, 26, are mixed in a mixer 32 and are poured into a cavity through the pouring head 12. When the cavity is filled with the resin perfectly, a sensor 44 detects the pressure of the resin and the control circuit 10 stops the supply of the resin of the resin supplying device 14, thereafter, switches the changeover valve 42 to communicate the pouring head 12 with a waste liquid tank 40 and commands a cleaning liquid and air supplying device 16 to discharge cleaning liquid and air alternately. The cleaning liquid and air clean the mixer 32 and the pouring head 12 while waste liquid is discharged into the waste liquid tank 40. The control circuit 10 controls the cleaning so that it is effect for a given time and is stopped.
申请公布号 JPS62134224(A) 申请公布日期 1987.06.17
申请号 JP19850274361 申请日期 1985.12.07
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 SEKIYAMA KENICHI;KAGEYAMA YASUSHI
分类号 B29C39/00;B29K101/10 主分类号 B29C39/00
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