发明名称 SOLDERING DEVICE FOR LEADLESS PARTS
摘要 PURPOSE:To contrive to curtail nonsoldering by executing degassing thoroughly by inclining an installation angle of a printed circuit board to a holding device part. CONSTITUTION:When soldering the leadless part 3 to a printed circuit board 2, the printed circuit board 2 is held by a holding device 1, so that the leadless parts 3 are arranged at about 45 deg. against the advance direction of a carrier. In this way, a means for waving, swinging, etc., a solder flow is not required, nonsoldering can be curtailed, and the coast of a soldering device itself can be reduced.
申请公布号 JPS62134169(A) 申请公布日期 1987.06.17
申请号 JP19850274548 申请日期 1985.12.05
申请人 NEC CORP 发明人 KARAHASHI SATORU
分类号 B23K1/08;H05K3/34 主分类号 B23K1/08
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