发明名称 Tin, lead, or tin-lead alloy plating bath
摘要 A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula <IMAGE> wherein R is a C1-4 hydrocarbon radical, M1 is a hydrogen atom or alkali metal atom, M2 is an alkali metal atom, and X1 and X2 are each a hydrogen atom, OH, COON, or SO3N (where N represents a hydrogen atom or alkali metal atom).
申请公布号 US4673470(A) 申请公布日期 1987.06.16
申请号 US19860831762 申请日期 1986.02.21
申请人 OBATA, KEIGO;DOHI, NOBUYASU;DAIWA FINE CHEMICALS CO., LTD.;ISHIHARA CHEMICAL CO., LTD. 发明人 OBATA, KEIGO;DOHI, NOBUYASU;OKUHAMA, YOSHIAKI;MASAKI, SEISHI;OKADA, YUKIYOSHI;YOSHIMOTO, MASAKAZU
分类号 C25D3/32;C25D3/36;C25D3/60;(IPC1-7):C25D3/32;C25D3/56 主分类号 C25D3/32
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