发明名称 HEAT-RESISTANT RESIN COMPOSITION FOR MOLDING
摘要 PURPOSE:The titled composition having improved heat resistance, heat insulating properties, mechanical properte is and sliding properties to light metals, obtained by blending a thermosetting resin a comprising a polymaleimide, etc., with a composite filter comprising a fluorine resin, etc. CONSTITUTION:(A) 30-70wt% thermosetting resin obtained by blending an addition product of a polymaleimide shown by formula I (R1 is n-functional organic group; X1 and X2 are H, halogen, etc.,; n is >=2 integer) and an aminobenzoic acid (e.g., o-aminobenzoic acid, etc.,) with an epoxy compound containing two or more epoxy groups (e.g., bisphenol A type epoxy resin, etc.,) is blended with (B) 30-70wt% composite filter comprising 50-83wt% fluororesin (e.g., tetrafluoro-ethylene resin, etc.,) and 5-38wt% benzoguanamine formaldehyde condensate [e.g., compound shown by formula II (k is >=2 integer), etc.,] to give the aimed composition. USE:A sliding material, friction material, etc.
申请公布号 JPS62132915(A) 申请公布日期 1987.06.16
申请号 JP19850271609 申请日期 1985.12.04
申请人 TOSHIBA CHEM CORP 发明人 OKAWA TSUTOMU
分类号 C08L63/00;C08G59/00;C08G59/40 主分类号 C08L63/00
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