| 摘要 |
PURPOSE:To facilitate the automation of plating work by placing an electrode which is brought into plane contact with one side of a substrate and a sealant for sealing the gap between the electrode and substrate in a metal plating apparatus in which a metal is deposited on the substrate to a prescribed thickness. CONSTITUTION:A semiconductor substrate 7 is fixed on a suction jig 1 with one side to be plated upward. At this time, the substrate 7 is fixed on silicone rubber 3 fitted to the peripheral wall of the jig 1, so that contact of the substrate 7 with the jig 1 does not occur. When suction is carried out from the suction hole 4, the substrate 7 is pressed against the silicone rubber 3 and brought into plane contact with the jig 1. The jig 1 is then put in a plating tank 10 and electric current is supplied between the anode 8 for plating and the jig 1 to plate the surface of the substrate 7 to be plated to the desired thickness.
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