发明名称 APPARATUS FOR APPLYING PARTING AGENT ON MOLD FOR SEALING SEMICONDUCTOR DEVICE WITH RESIN
摘要 PURPOSE:To automatize the parting agent spraying process while enabling the amount of sprayed parting agent to be controlled and uniformized, by controlling the pressures and amounts of high-pressure air and of a parting gent by means of regulators and solenoid valves while controlling, as required, various parameters of an external parting agent such as an amount to be sprayed, a particle diameter or applying frequencies. CONSTITUTION:High-pressure air from a supply source 4 is passed through a filter 5 to remove impurities contained therein. The high-pressure air is on one hand regulated to have a constant pressure by a regulator 6a and sent to a spraying nozzle 11a through a solenoid valve 8a. The high-pressure air on the other hand is sent to a parting agent tank 9 through a regulator 6b and a solenoid valve 8b. A parting agent is transported by the high-pressure air which is introduced into the tank 9 having regulated pressure and flow rate. The transported parting agent is regulated in its flow rate by a variable valve 10 and sent to a spraying nozzle 11a provided in a cleaning section. Accordingly, the parting agent spraying process can be automatized and the parting agent can be sprayed in a controlled and uniform amount.
申请公布号 JPS62133727(A) 申请公布日期 1987.06.16
申请号 JP19850273478 申请日期 1985.12.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIMOMURA KO;SHINOHARA TOSHIAKI;AKIYAMA TATSUHIKO
分类号 H01L21/56;B05B7/06;B22D17/20;B29C33/58 主分类号 H01L21/56
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