发明名称 ETCHING APPARATUS
摘要 PURPOSE:To etch a plurality of materials to be etched at once by automatically conveying wafers from a loading side through a vacuum chamber to an unloading side. CONSTITUTION:A loading standard cassette 14 containing a plurality of wafers 63 is approached to an intrinsic cassette 16 installed in a loading mechanism. Thereafter, a pusher 44 is moved forward, and the wafers 63 are set in grooves 33 between shielding plates 34 of the cassette 16. Then, engaging portions 15 of the cassette 16 are held by holders 21a, 21b of a conveying robot 20, and conveyed into a vacuum chamber 12 of an etching mechanism 13 to etch the wafers. Then, the cassettes 16 are conveyed to an unloading mechanism 19 by the robot 20, and an unloading standard cassette 18 is approached to the cassette 16. Thereafter, a pusher 60 is moved forward to set the wafer 63 in the cassette 16 in a standard cassette 18.
申请公布号 JPS62132322(A) 申请公布日期 1987.06.15
申请号 JP19850273062 申请日期 1985.12.04
申请人 TOKUDA SEISAKUSHO LTD 发明人 MAEGAKI YOSHIKAZU
分类号 H01L21/677;H01L21/302;H01L21/3065;H01L21/67;H01L21/68 主分类号 H01L21/677
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