发明名称 SYNTHETIC RESIN MOLDING DEVICE
摘要 PURPOSE:To constitute the titled device so that a molten molding material covers uniformly along with heating of the titled resin efficiently, by providing a heat pump, both temperature sensors detecting the temperatures of a mold and molten resin and a device controlling an action of a heat pump. CONSTITUTION:The titled device is provided with a heat pump 62 enabling heat to be radiated within a resin melting cylinder or an injection cylinder 23 by absorbing the heat of a mold 4 and the mold 4 to be heated absorbing the heat of the resin melting cylinder 23, the injection cylinder and/or the oher heat source, a temperature sensor 60 detecting the temperature of the mold 4, a temperature sensor 11 detecting the temperature of molten resin, and a device 5 controlling an action of the heat pump 62 according to outputs of both the temperature sensors 60, 11. A heated and molten molding material is supplied so as to uniformly cover every part of the inside of a mold cavity along with possibility of heating the same more efficiently by constituting the titled device in this manner. Fine holes and cracks or distortion of a product are prevented from occurring and further molding accuracy is improved.
申请公布号 JPS62132627(A) 申请公布日期 1987.06.15
申请号 JP19850271660 申请日期 1985.12.04
申请人 INOUE JAPAX RES INC 发明人 INOUE KIYOSHI
分类号 B29C45/54;B29C45/72;B29C45/76;B29C45/78;F25B30/00 主分类号 B29C45/54
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