| 摘要 |
PURPOSE:To improve the reliability of manufacturing a semiconductor device by disposing a resin used at the time of securing a semiconductor device to a circuit board only at substantially center of the device, and filling the resin in the remaining gap, thereby raining the bonding strength of the wirings to a LSI chip. CONSTITUTION:Substantially the center of a portion to be secured with a LSI chip is coated with a resin 3 after a substrate 1 having wirings 2. The chip 4 is positioned at its electrode 5 to wirings 2' of the substrate 1, and pushed to be contacted with the substrate 1 by a pressing tool 6. At this time, the resin 3 is spread, but the electrode 5 is not covered with the resin 3, thereby obtaining a contact of the electrode 5 of the chip 4 with the wirings 2' in high reliability. A resin 7 is filled in a gap between the chip 4 and the substrate 1 to obtain a rigid bonding. The resin 7 may be different in components from the resin 3. Since the electrode 5 and the wirings 2 are contacted by the bonding strength of the resin 3 at this time, the resin 7 is not introduced to between the electrode 5 and the wirings 2. A protecting resin 8 is eventually formed. |
